The POU3500 procedure offers dynamic temperature Charge of the process chamber cathode / electrode / anode and can be synchronized with any etch course of action.
Device check here & TCU computer software calibration techniques vary external test devices not employed often for verifying
The information down below is classified by semiconductor system and Device maker. Just about every desk consists of an apps Matrix that shows qulified and business procedures.
Originally Started in 1985, our organization has developed right into a acknowledged leader in delivering temperature Regulate programs to the global semiconductor business.
This extraordinary system, giving a small type issue, cheap-of-possession and Dynamic Temperature Management presented method and machines engineers a different Device to improve their temperature delicate processes.
The precision of the POU 3300 allows for unbiased control of the method fluid temperature into the wafer chuck inside +/- 0.1 °C of set stage, and also the quickly response time of your method lets for max wafer-to-wafer repeatability through the etch method.
The accuracy of the POU 3500 permits unbiased Charge of the process fluid temperature on the wafer chuck in +/- 0.1 °C of set level, along with the quick reaction time of the program lets for maximum wafer-to-wafer repeatability throughout the etch method.
With our unit strategically mounted somewhere around 6 feet with the chamber, we attain a much more correct reading with the chuck temperature. This method makes certain regular temperature through the production large amount, bringing about improved wafer-to-wafer CD uniformity.
The data pertains into a 300mm chamber temperature profile during a higher component ratio Etch procedure, functioning at extremely large RF electric power problems (~three.8kW). The powerful aspects of this data set are:
Dynamic Temperature Control, as applied in systems like the LAUDA-Noah POU, can be an tactic that senses the temperature of the method fluid returning from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature from the supplied process fluid dependant on this real-time feed-back.
The TEs' can switch directly from heating to cooling, or visa-versa. they will turn on & off even though from the heating or cooling method and might raise or lower the level of heating or cooling devoid of switching in any way.
over ever, shrinking gadget geometries, demanding new procedures plus a remarkably competitive atmosphere need temperature Manage devices that Merge rapid and correct temperature Command with an emphasis on diminished running expenditures and improved dependability.
verified; TEs' characterize only one Portion of a chiller's structure. The switching & control techniques utilized by a chiller will impact the TEs' reliability.
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We require a lot less cooling/heating capacity for the same application for a static TCU due to our little reservoir volume.